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Freescale Semiconductor Technical Data
MPX4101A Rev 6, 12/2006
Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The Freescale MPX4101A/MPXA4101A/MPXH6101A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The small form factor and high reliability of on-chip integration makes the Freescale MAP sensor a logical and economical choice for automotive system designers. The MPX4101A/MPXA4101A/MPXH6101A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Features * 1.72% Maximum Error Over 0 to 85C * Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems * Temperature Compensated Over -40C to +125C * Durable Epoxy Unibody Element or Thermoplastic (PPS) Surface Mount Package Typical Applications * Manifold Sensing for Automotive Systems * Ideally Suited for Microprocessor or Microcontroller-Based Systems * Also Ideal for Non-Automotive Applications UNIBODY PACKAGE PIN NUMBERS(1)
1 2 3 VOUT GND VS 4 5 6 N/C N/C N/C
MPX4101A MPXA4101A MPXH6101A SERIES
INTEGRATED PRESSURE SENSOR 15 TO 102 kPA (2.18 TO 14.8 psi) 0.25 TO 4.95 V OUTPUT
UNIBODY PACKAGE
MPX4101A CASE 867-O8
SMALL OUTLINE PACKAGE
MPXA4101AC6U CASE 482A-01
1. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
SUPER SMALL OUTLINE PACKAGE
SMALL OUTLINE PACKAGE PIN NUMBERS(1)
1 2 3 4 N/C VS GND VOUT 5 6 7 8 N/C N/C N/C N/C
SUPER SMALL OUTLINE PACKAGE PIN NUMBERS(1)
1 2 3 4 N/C VS GND VOUT 5 6 7 8 N/C N/C N/C N/C MPXH6101A6U/6T1 CASE 1317-04
1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
ORDERING INFORMATION
Device Type Options Case No. UNIBODY PACKAGE (MPX4101A SERIES) Basic Element Absolute, Element Only 867 SMALL OUTLINE PACKAGE (MPXA4101A SERIES) Ported Element Absolute, Axial Port 482A SUPER SMALL OUTLINE PACKAGE (MPXA6101A SERIES) Basic Element Absolute, Element Only 1317 Absolute, Element Only 1317 MPX Series Order No. MPX4101A MPXA4101AC6U MPXH6101A6U MPXH6101A6T1 Rails Rails Tape and Reel Packing Options -- Device Marking MPX4101A MPXA4101A MPXH6101A MPXH6101A
(c) Freescale Semiconductor, Inc., 2006. All rights reserved.
VS
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1
Gain Stage #2 and Ground Reference Shift Circuitry
Vout
GND
Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package devices. Pins 4, 5, and 6 are NO CONNECTS for unibody devices.
Figure 1. Temperature Compensated and Calibrated Pressure Sensor Schematic Table 1. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol PMAX TSTG TA Value 400 -40 to +125 -40 to +125 C Unit kPa C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX4101A 2 Sensors Freescale Semiconductor
Table 2. Operating Characteristics (VS = 5.1 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.)
Characteristic Pressure Range Supply Voltage Supply Current Minimum Pressure Offset @ VS = 5.1 Volts Full Scale Output @ VS = 5.1 Volts Full Scale Span @ VS = 5.1 Volts Accuracy(6) Sensitivity Response Time(7) Output Source Current at Full Scale Output Warm-Up Time(8) Offset Stability(9) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
(4) (3) (1)
Symbol POP VS Io (0 to 85C) (0 to 85C) (0 to 85C) (0 to 85C) Voff VFSO VFSS -- V/P tR Io+ -- --
Min 15 4.85 -- 0.171 4.870 -- -- -- -- -- -- --
Typ -- 5.1 7.0 0.252 4.951 4.7 -- 54 15 0.1 20 0.5
Max 102 5.35 10 0.333 5.032 -- 1.72 -----------
Unit kPa Vdc mAdc Vdc Vdc Vdc %VFSS mV/kPa ms mAdc ms %VFSS
(2)
(5)
MPX4101A Sensors Freescale Semiconductor 3
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
Figure 2 illustrates an absolute sensing chip in the super small outline package (Case 1317). Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85C. The output will saturate outside of the specified pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4101A/ MPXA4101A/MPXH6101A series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.
Die P1 Wire Bond Lead Frame Thermoplastic Case
Fluoro Silicone Gel Die Coat
Stainless Steel Cap
Absolute Element Sealed Vacuum Reference
Die Bond
Figure 2. Cross Sectional Diagram SSOP (not to scale)
+5.1 V
5.0 4.5 4.0 Output (Volts) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0
VS Pin 2 MPXH6101A 100 nF GND Pin 3 Vout Pin 4 47 pF 51 K to ADC
Transfer Function: Vout = Vs* (PX0.01059*P-0.10941) Error VS = 5.1 Vdc Temperature = 0 to 85C 20 kPa to 105 kPa MPX4101A
TYP
MAX MIN
Figure 3. Recommended Power Supply Decoupling and Output Filtering
MPX4101A 4 Sensors Freescale Semiconductor
5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
Transfer Function (MPX4101A, MPXA4101A, MPXH6101A)
Nominal Transfer Value: Vout = VS (P x 0.01059 - 0.10941)
(Pressure Error x Temp. Factor x 0.01059 x VS) VS = 5.1 V 0.25 Vdc
Temperature Error Band
MPX4101A, MPXA4101A MPXH6101A SERIES
4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in C NOTE: The Temperature Multiplier is a linear response from 0C to -40C and from 85C to 125C. Temp -40 0 to 85 +125 Multiplier 3 1 3
Pressure Error Band
3.0 2.0 Pressure Error (kPa) 1.0 0.0 -1.0 -2.0 -3.0 0 15
Error Limits for Pressure
30
45
60
75
90
105
120
Pressure (in kPa)
Pressure 15 to 102 (kPa)
Error (Max) 1.5 (kPa)
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Freescale pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below:
Pressure (P1) Side Identifier Stainless Steel Cap Side with Port Attached Stainless Steel Cap Stainless Steel Cap
Part Number MPX4101A MPXA4101AC6U MPXH6101A6U MPXH6101A6T1
Case Type 867 482A 1317 1317
MPX4101A Sensors Freescale Semiconductor 5
INFORMATION FOR USING THE SMALL OUTLINE PACKAGES
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total footprint, the packages will self align when subjected to a design. The footprint for the surface mount packages must be solder reflow process. It is always recommended to design the correct size to ensure proper solder connection interface boards with a solder mask layer to avoid bridging and between the board and the package. With the correct shorting between solder pads.
0.660 16.76
0.100 TYP 8X 2.54
0.060 TYP 8X 1.52
0.300 7.62
0.100 TYP 8X 2.54
inch mm
SCALE 2:1
Figure 5. SOP Footprint (Case 482)
0.050 1.27 TYP 0.150 3.81
0.387 9.83
0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm
Figure 6. SSOP Footprint (Case 1317)
MPX4101A 6 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
-A4 5
D
8 PL
0.25 (0.010)
M
TB
S
A
S
N
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C H J K M
PIN 1 IDENTIFIER
-TSEATING PLANE
DIM A B C D G H J K M N S V W
CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE
C R M B -AN
PIN 1 SEATING PLANE
1 2 3 4 5 6
POSITIVE PRESSURE (P1)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
INCHES MILLIMETERS MAX MIN MAX MIN 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.027 0.033 0.68 0.84 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30 NOM 30 NOM 12.57 0.475 0.495 12.07 0.430 0.450 10.92 11.43 0.090 0.105 2.29 2.66
L
-TG F D 6 PL 0.136 (0.005)
M
J S
TA
M
DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
VOUT GROUND VCC V1 V2 VEX
STYLE 2: PIN 1. 2. 3. 4. 5. 6.
OPEN GROUND -VOUT VSUPPLY +VOUT OPEN
STYLE 3: PIN 1. 2. 3. 4. 5. 6.
CASE 867-08 ISSUE N UNIBODY PACKAGE
MPX4101A Sensors Freescale Semiconductor 7
PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE
MPX4101A 8 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 2 OF 3
CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE
MPX4101A Sensors Freescale Semiconductor 9
PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE
MPX4101A 10 Sensors Freescale Semiconductor
NOTES
MPX4101A Sensors Freescale Semiconductor 11
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MPX4101A Rev. 6 12/2006

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